AP SYSTEMS CORPORATION

AP SYSTEMS CORPORATION

With continuous and concentrated research and development, we create new values in the semiconductors and display manufacturing equipment fields.

AP Systems entered the semiconductor equipment market based on our accumulated knowhow on equipment control software. Since then, we have expanded into mid to small-sized LCD equipment, semiconductor processing equipment for 300mm wafers, and large-sized LCDs, and are currently leading the fields of ELA (Excimer Laser Annealing), LLO (Laser Lift-Off), and OLED Encapsulation, which are the laser equipment necessary for the production of OLED panels. We will continue to grow as a world-renowned total equipment company through endless development based on our top five value Autonomy, Pioneer in Technology, Superiority, Openness, Never ending Challenge.

Cleaning; Washing Equipment for Assembly & Packaging, Dicing; Sawing; Scribing; Separation Equipment, Dispensing Systems, Tape Automated Bonding (TAB); Bumped Tape Automated Bonding (BTAB) Equipment, Wafer Level Bonders, Laser Treatment; Cutting Systems for Panels & Photocells, Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating, Lamination; Sheet Laminating Equipment, Defect; Particle; Bump; Contamination Detection, Review or Inspection, Deep RIE etching; Dry Etching, Wafer Level Bonders, Coat; Develop; Resist Processing; Track Equipment , Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment , Etching; Stripping; Ashing - Dry and Wet Equipment , Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment , Manufacturing Execution Software (MES)